RO3035 2-Layer 0.37mm PCB – 10mil Ceramic-Filled PTFE with Immersion Gold for 5G & mmWave
1.Introduction to RO3035 2-Layer 0.37mm PCB
Rogers RO3035 laminates are ceramic-filled, PTFE-based high-frequency circuit materials belonging to the RO3000 series. These materials maintain similar mechanical properties while offering different dielectric constants (Dk), enabling designers to develop multi-layer board designs without compromising on warpage or reliability. RO3035 laminates feature a stable dielectric constant across varying temperatures, providing ideal design solutions for 5G communications, millimeter-wave applications below 6GHz, and massive MIMO systems.
2.Key Features
Rogers RO3035 ceramic-filled PTFE composite material
Dielectric constant: 3.5 ± 0.05 at 10 GHz/23°C
Dissipation factor: 0.0015 at 10 GHz/23°C
Thermal decomposition temperature: >500°C
Thermal conductivity: 0.5 W/m·K
Moisture absorption: 0.04%
Coefficient of Thermal Expansion (-55 to 288°C): X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C
3.Benefits
Suitable for applications up to 30-40 GHz
Lower operating temperature and enhanced reliability in power amplifiers
Uniform mechanical properties across dielectric constant range
Ideal for multi-layer board designs with varying dielectric constants
Compatible with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient matched to copper
Enables reliable surface mounted assemblies
Excellent dimensional stability for temperature-sensitive applications
Volume manufacturing process for cost-effective production
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3035 |
| Layer Count | 2 layers |
| Board Dimensions | 60mm × 30mm |
| Min. Trace/Space | 5 mil / 7 mil |
| Min. Hole Size | 0.3 mm |
| Blind Vias | No |
| Finished Board Thickness | 0.37 mm |
| Finished Cu Weight | 1 oz (outer layers) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top/Bottom Silkscreen | No |
| Top/Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RO3035 Substrate - 10mil (0.254mm)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 10
Total Pads: 63
Thru Hole Pads: 41
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 21
Nets: 2
7.Typical Applications
Automotive radar systems
Global positioning satellite antennas
Cellular telecommunications systems (power amplifiers and antennas)
Patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
